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Huaswin Electronics Co.,Limited
Huaswin Electronics Co.,Limited Rigid PCB, Flexible PCB, Rigid Flex PCB, PCB Assembly, SMT / Through hole Assembly, custom cable assembly manufacturer in China
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Aluminum Based / FR4 LED PCB Assembly LED PCBA with LED Lights

Huaswin Electronics Co.,Limited
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Aluminum Based / FR4 LED PCB Assembly LED PCBA with LED Lights

Brand Name : HUASWIN

Model Number : HSPCBA1007

Certification : ISO/UL/RoHS

Place of Origin : China

MOQ : 1 sets

Price : Negotiation

Payment Terms : T/T, Western Union, L/C

Supply Ability : 10,000pcs per month

Delivery Time : 15-20 working days

Packaging Details : Anti-static bag + Anti-static bubble wrap + Good quality carton box

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High quality Led pcb assembly, led pcba with led lights (Aluminum-based & FR4 material

Specifications

led pcb assembly
1. PCB layout and fabrication
2. Components procurement
3. PCB Assembly of SMT and DIP

4. IC pre-program / burning on line

5. High-precision E-Testing include: AOI, ICT, functional test,

6. Aging test for all LED PCBA

We can ensure the best price, good quality, fast delivery and best after-sales service!

Welcome to Huaswin!

Huaswin Electronics is a professional PCB & PCB Assembly manufacturer, located in Shenzhen, China.

We supply one-stop facility services: PCB design, PCB fabrication, components procurement, SMT and DIP

assembly ,IC pre-programming / burning on-line, testing, anti-static packing.

PCB capability and services:


1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)

2. Flexible PCB (up to 10 layers)

3. Rigid-flex PCB (up to 8 layers)

4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test

Detailed Specification of PCB Manufacturing

1

layer

1-30 layer

2

Material

CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide,

Aluminum-based material.

3

Board thickness

0.2mm-6mm

4

Max.finished board size

800*508mm

5

Min.drilled hole size

0.25mm

6

min.line width

0.075mm(3mil)

7

min.line spacing

0.075mm(3mil)

8

Surface finish

HAL, HAL Lead free,Immersion Gold/ Silver/Tin,

Hard Gold, OSP

9

Copper thickness

0.5-4.0oz

10

Solder mask color

green/black/white/red/blue/yellow

11

Inner packing

Vacuum packing,Plastic bag

12

Outer packing

standard carton packing

13

Hole tolerance

PTH:±0.076,NTPH:±0.05

14

Certificate

UL,ISO9001,ISO14001,ROHS,TS16949

15

Profiling punching

Routing,V-CUT,Beveling


PCB Assembly services:

SMT Assembly
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection

Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering

Material Sourcing
IC pre-programming / Burning on-line

Function testing as requested

Aging test for LED and Power boards

Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design

Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is

applied onto the printed circuit board assembly to protect the electronic assembly from damage due to

contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.

When coated, it is clearly visible as a clear and shiny material.


Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,

plastics, casings and print & packaging material

Testing Methods

AOI Testing
· Checks for solder paste
· Checks for components down to 0201"
· Checks for missing components, offset, incorrect parts, polarity

X-Ray Inspection
X-Ray provides high-resolution inspection of:
· BGAs
· Bare boards

In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by

component problems.
· Power-up Test
· Advanced Function Test
· Flash Device Programming
· Functional testing

Detailed Specification of Pcb Assembly

1

Type of Assembly

SMT and Thru-hole

2

Solder Type

Water Soluble Solder Paste,Leaded and Lead-Free

3

Components

Passives Down to 0201 Size

BGA and VFBGA

Leadless Chip Carries/CSP

Double-Sided SMT Assembly

Fine Pitch to 08 Mils

BGA Repair and Reball

Part Removal and Replacement-Same Day Service

3

Bare Board Size

Smallest:0.25x0.25 Inches

Largest:20x20 Inches

4

File Formats

Bill of Materials

Gerber Files

Pick-N-Place File(XYRS)

5

Type of Service

Turn-Key,Partial Turn-Key or Consignment

6

Component Packaging

Cut Tape

Tube

Reels

Loose Parts

7

Turn Time

15 to 20 days

8

Testing

AOI inspection

X-Ray inspection

In-Circuit testing

Functional test


Product Tags:

led light assembly

      

led lamp assembly

      
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